Products
HIGH THERMAL CONDUCTIVE POTTING ADHESIVE
Themmal conductive potting glue is a low-viscosity two-component silicone pottingmaterial. This product has good fluidity, does not produce small molecules during curing, hasexcellent thermal conducivity and insulation properties after curing, and has no comosion tovarious substrates. it is mainly used for potting of electronic components and circuit boardssuch as driving power supplies. Sensors, photovoltaic jundion boxes, etc,, provide protectionfor electrical/electronic devices and components under severe conditions such as high humidityextreme temperature, themmal cycle stress, mechanical shock and vibration, mold, dirt, etc, nocontact thermal resistance, seamless contact Heat-generating electronic components, heat isconducted from the separation device or the entire PcB to the metal shell or diffusion platethereby improving the efficiency and service life of the heat-generating electronic components.
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TWO COMPONENT THERMAL CONDUCTIVE GEL
Two component thermal conductive gel is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible and thermally conductive elastomer,which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high efficiency. It has good contact with electronic products, increases effective contact area and reduces contact thermal resistance. It can automatically fill the gap and compress infinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.
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ONE-PART THERMAL CONDUCTIVE GEL
Single component thermal conductive gel is a kind of thermal conductive material with lower deformation force. It has similar plasticity of plasticized, non flowing, high thermal conductivity and low thermal resistance. It has good insulation, good insulation, and can fill the gap automatically, so that the contact area can reach full contact. It can be applied to the heat dissipation module or electronic component with larger thickness. Unlike thermal conductive silicone grease, heat conductive gel has no sedimentation and no flow phenomenon. It is suitable for screen printing or scraping. The syringe packaging can be dispensed on standard dispensing equipment, so as to effectively improve operation convenience and efficiency.
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LOW SPECIFIC GRAVITY LOW DIELECTRIC THERMAL PAD
Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.
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HEAT CONDUCTION RADIO ABSORBING PAD
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.
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ULTRA HIGH THERMAL PAD
Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
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HIGH THERMAL PAD
High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
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THERMAL PAD
LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
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