TWO COMPONENT THERMAL CONDUCTIVE GEL

Two component thermal conductive gel is a preformed thermal gap ﬁlling material, which can be solidiﬁed at room temperature or high temperature to form a ﬂexible and thermally conductive elastomer,which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high eﬃciency. It has good contact with electronic products, increases eﬀective contact area and reduces contact thermal resistance. It can automatically ﬁll the gap and compress inﬁnitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.

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Category:

Thermal conductive sealant

Keyword： TWO COMPONENT THERMAL CONDUCTIVE GEL

Product Introduction Data Download

Product features

High thermal conductivity, low thermal resistance, good wettability
Lower assembly stress, easy to operate
High reliability, after curing, it is equivalent to thermal pad, no volatilization
Automatic dispensing adjustment of any thickness
After curing, the modulus is low, which greatly reduces the stress caused by thermal expansion and the damage caused by vibration

Typical applications

Network terminal /5g mobile phone communication
New energy battery
Automotive electronic application equipment
Electronic medical / power equipment
Between fragile components and housing

Item	Unit	LCF200	LCF300	LCF400	LCF500	LCF600	LCF800	Test method
Color A component/B component		White / Blue	White / Blue	White / Pink	White / Grey	White / Grey	White / Grey	Visual inspection
Extrusion rate	g/min	20	25	40	20	15	10	90psi@φ1.85mm
Mixing ratio	-	1:01	1:01	1:01	1:01	1:01	1:01	ASTM D149
Hardness	Shore AO	20±5	20±5	20±5	20±5	30±5	30±5	GB/T 531
Hardness	Shore OO	50±10	50±10	50±10	50±10	70±10	70±10	ASTM D2240
Density	g/cm3	2.75	3.09	3.13	3.2	3.26	3.07	ASTM D792
Breakdown voltage	KV/mm	≥10	≥7.5	≥7	≥7	≥10	≥8	ASTM D149
Volume resistivity	Ω·cm	1×1012	1×1012	1×1011	1×1011	1×1012	5×1012	ASTM D257
Weight loss	%	≤0.3	≤0.3	≤0.3	≤0.3	≤0.3	≤0.3	@150℃240H
Temperature resistance range	℃	-40~150	-40~150	-40~150	-40~150	-40~150	-40~150	-
Fire resistance	-	V-0	V-0	V-0	V-0	V-0	V-0	UL 94
Surface drying time	min	45	45	45	45	45	45	ASTM C679
Thermal conductivity	W/m · K	2.0±0.2	3.0±0.3	3.8±0.3	5.0±0.3	6.0±0.3	8.0±0.3	ISO 22007
Thermal conductivity	W/m · K	2.0±0.2	3.0±0.3	3.8±0.3	5.0±0.3	6.0±0.3	8.0±0.3	ASTM D5470
Thermal impedance @ 1mm	℃·in2/W	1.28	0.687	0.43	0.332	0.318	0.283	ASTM D5470
Thermal impedance @ 1mm	℃·cm2/W	8.256	4.432	2.775	2.141	2.05	1.826	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K)	0.964	0.936	0.712	0.845	0.821	0.981	ASTM E1269

Package description: the two-component thermal conductive adhesive is divided into manualoperation type and dispensing type. The manualoperation type oftwo-componenthermalconductive adhesive is generally divided into 5omlAB hose package (25mlA /b each), which is suitablefo!sinale hand operation, The two-componentthermalconductive adhesive for dispensina is generalypacked in 400mlA8 hose, and can also beseparately packed in 10kg / barrel of glue a and 10kg / barrel of glue B according to the needs of dispensing machine.

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