ONE-PART THERMAL CONDUCTIVE GEL

Single component thermal conductive gel is a kind of thermal conductive material with lower deformation force. It has similar plasticity of plasticized, non ﬂowing, high thermal conductivity and low thermal resistance. It has good insulation, good insulation, and can ﬁll the gap automatically, so that the contact area can reach full contact. It can be applied to the heat dissipation module or electronic component with larger thickness. Unlike thermal conductive silicone grease, heat conductive gel has no sedimentation and no ﬂow phenomenon. It is suitable for screen printing or scraping. The syringe packaging can be dispensed on standard dispensing equipment, so as to eﬀectively improve operation convenience and efficiency.

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Category:

Thermal conductive sealant

Keyword： ONE-PART THERMAL CONDUCTIVE GEL

Product Introduction Data Download

Product features

High thermal conductivity, low thermal resistance, good wettability
No settlement, no flow, can fill any uneven gap
Soft, no stress, can be compressed to 0.1 mm thin
The design and application are convenient, and the automatic dispensing can adjust the size of any thickness

Typical applications

Wireless electronic equipment
Communication electronic hardware equipment
Automotive electronic application equipment
Chassis or related heat dissipation module
Host or small office network equipment
Microprocessors, memory chips and graphics processors

Item	Unit	LCE200	LCE300	LCE380	LCE500	LCE600	LCE700	Test method
Color	-	Blue	Pink	Pink	Grey	Blue	Grey	Visual inspection
Density	g/cc	2.98	3.37	3.39	3.44	3.38	3.5	ASTM D792
Extrusion rate	g/min	≥40	≥40	≥40	≥20	≥15	≥10	φ2.54mm90psi
Typical thickness after compression	mm	0.1	0.1	0.1	0.2	0.2	0.2	-
Weight loss	%	≤0.3	≤0.3	≤0.2	≤0.2	≤0.2	≤0.2	@150℃240H
Breakdown voltage	KV/mm	≥7	≥7	≥7	≥7	≥5	≥5	ASTM D149
Volume resistivity	Ω·cm	1×1013	1×1013	1×1013	1×1013	1×1012	1×1011	ASTM D257
Temperature resistance range	℃	-40～ 150	-40～ 150	-40～ 200	-40～ 150	-40～ 150	-40～ 150	-
Thermal conductivity	W/m · K	2	3	4	5	6	7	ISO 22007-2
Thermal conductivity	W/m · K	2	3	4	5	6	7	ASTM D5470
Thermal impedance	℃·in2/W	0.09	0.058	0.046	0.033	0.024	0.023	ASTM D5470
Thermal impedance	℃·cm2/W	0.58	0.374	0.296	0.213	0.154	0.148	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K)	0.856	0.738	0.773	0.784	0.625	0.66	ASTM E1269

Conventionalpackaging:1kg /can, 5 kg / barrel, 10 kg / barrel, 20 kg / barrel

Syringe:30cc,55cc,300cc

Note:Thermal impedance at 0.1mm

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