Provide Heat Conduction and Cooling Solutions
PRODUCT
Highly stable and reliable thermal interface material
Thermal PAD
Thermal conductive pad can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces...
Thermal conductive sealant
Thermal conductive gel pad is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible...
FEATURED PRODUCTS
Highly stable and reliable thermal interface material
HEAT CONDUCTION RADIO ABSORBING PAD
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.
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LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
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High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
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Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
Learn moreABOUT US
14 Years Of Focus On R & D And Production Of Thermal Interface Materials
Shenzhen Union Tenda Technology Co., Ltd was established in 2011, registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters. which is a professional high-tech enterprise engaged in R&D, production and sales of thermal interface materials.
Production Base
Technology accumulation
R&D and technology investment
CERTIFICATE
Since its establishment, the company has successively passed: ISO9001 quality management system certification,ISO14001 environmental management system certification, ISO45001 occupational health and safety management system certification and IATF16949 quality management system certification
WHY CHOOSE US
Manufacturing Capability
R&D Capability
Cooperation Experience
Provide thermal conductivity and heat dissipation products and solutions for numerous customers
BLOG
Jun 13,2026
Understanding Ceramic Heat Sink Substrates: The Future of Thermal Management in Building Materials
Ceramic heat sink substrates are gaining traction in various fields, especially in thermal management applications where efficient heat dissipation is critical. These substrates are made from advanced ceramic materials that provide excellent thermal conductivity while maintaining electrical insulation properties. This unique combination makes them particularly suitable for applications where heat
Jun 12,2026
Silicone Thermal Interface Material: Enhancing Comfort in Modern Homes
Silicone Thermal Interface Material: Enhancing Comfort in Modern Homes Table of Contents 1. Introduction to Silicone Thermal Interface Materials 2. What is Silicone Thermal Interface Material? 3. Benefits of Using Silicone Thermal Interface Materials 4. Applications in Modern Homes 5. How Silicone Thermal Interface Material Improves Energy Efficiency 6. Installation Guide
Jun 11,2026
Understanding Thermal Conductive Silicone Caps: Essential Components in Construction and Decoration
Thermal conductive silicone caps are innovative materials widely utilized in the construction and decoration sector for their unique properties. These caps are primarily composed of silicone rubber, infused with thermally conductive fillers, allowing them to effectively transfer heat while maintaining excellent flexibility and durability. This combination of traits makes them particularly valuable
Jun 10,2026
The Science Behind Ceramic Substrates in Power Electronics: Exploring Applications and Advantages
The Science Behind Ceramic Substrates in Power Electronics Table of Contents 1. Introduction to Ceramic Substrates 2. Understanding Power Electronics 3. The Role of Ceramic Materials in Power Electronics 3.1 Thermal Conductivity 3.2 Electrical Insulation 3.3 Mechanical Strength 4. Types of Ceramic Substrates 4.1 Alumina (Al2O3) 4.2 Aluminum Nitride (AlN) 4.3 Silicon Nitride (Si3N4) 5. Manufacturin
Jun 09,2026
Innovative Thermal Materials: Enhancing Smart Devices in Modern Architecture
In today's rapidly advancing technological landscape, the integration of smart devices into architectural designs is becoming increasingly common. A pivotal aspect of this integration is the utilization of thermal materials, which play a crucial role in enhancing the performance and sustainability of smart devices. In this context, thermal materials refer to substances that can effectively manage
Jun 08,2026
Comparative Analysis: Ceramic Heat Sink Substrates vs. Traditional Materials
Comparative Analysis: Ceramic Heat Sink Substrates vs. Traditional Materials Introduction to Heat Sink Technologies In today's fast-paced technological landscape, efficient thermal management is crucial for the performance and longevity of electronic components. Heat sinks play an essential role in dissipating heat away from sensitive devices, ensuring they operate within safe temperature limits.
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