Provide Heat Conduction and Cooling Solutions
14 Years Of Focus On R & D And Production Of Thermal Interface Materials LEARN MORE

PRODUCT

Highly stable and reliable thermal interface material

Thermal PAD

Thermal conductive pad can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces...

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Thermal conductive sealant

Thermal conductive gel pad is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible...

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FEATURED PRODUCTS

Highly stable and reliable thermal interface material

HEAT CONDUCTION RADIO ABSORBING PAD

Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.

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THERMAL PAD

LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.

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HIGH THERMAL PAD

High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.

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ULTRA HIGH THERMAL PAD

Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.

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ABOUT US


14 Years Of Focus On R & D And Production Of Thermal Interface Materials

Shenzhen Union Tenda Technology Co., Ltd was established in 2011, registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters. which is a professional high-tech enterprise engaged in R&D, production and sales of thermal interface materials.

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Production Base
10000 m²

Production Base

Technology accumulation
14 Years

Technology accumulation

R&D and technology investment
50 Million

R&D and technology investment

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CERTIFICATE


Since its establishment, the company has successively passed: ISO9001 quality management system certification,ISO14001 environmental management system certification, ISO45001 occupational health and safety management system certification and IATF16949 quality management system certification

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WHY CHOOSE US

Manufacturing Capability

Manufacturing Capability

Fourteen years of professional production experience, 10000 square meters of large-scale production base, multiple fully automatic thermal conductive material production lines, mature production process flow.
R&D Capability

R&D Capability

Advanced testing and research laboratory dedicated to in-depth exploration and research in the field of polymer materials.
Cooperation Experience

Cooperation Experience

We have long-term cooperation experience with many excellent enterprises. Customers choose us not only for price advantages, but more importantly for quality and service.
WHY CHOOSE US

Provide thermal conductivity and heat dissipation products and solutions for numerous customers

BOSCH
PHILIPS
EMERSON
BROAD-OCEAN
BAK
SUNGROW
SAMSUNG
CLOU
leyard
INFY POWER
DPC
Lenovo
Enpower
nvc
TonHe
TOPBAND
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BLOG

Oct 14,2026

Unlocking the Potential of Two-Component Thermal Conductive Gel in Thermoplastic Elastomers

In the world of thermoplastic elastomers (TPE), thermal management is a significant challenge, especially in applications where heat dissipation is crucial. One innovative solution that has gained traction is the use of two-component thermal conductive gel. This advanced material combines the properties of a traditional thermal interface material with the flexibility and durability of TPEs, making

Oct 09,2026

Understanding the Role of Thermal Conductive Silicone Sheets in Electronics

Understanding the Role of Thermal Conductive Silicone Sheets in Electronics Table of Contents Introduction to Thermal Conductive Silicone Sheets The Importance of Thermal Management in Electronics Key Properties of Thermal Conductive Silicone Sheets Applications of Thermal Conductive Silicone in Electronics Consumer Electronics Automotive Industry

Oct 04,2026

Exploring the Benefits of Ceramic Heat Sink Substrates in Construction

Ceramic heat sink substrates have emerged as a vital component within the construction and decorative materials industry, particularly in applications requiring effective thermal management. These substrates are primarily designed to dissipate heat efficiently, making them ideal for various electronic and architectural applications. Their unique properties set them apart from traditional heat sink

Sep 29,2026

Real-World Applications of Silicone Thermal Interface Material in Building Projects

Real-World Applications of Silicone Thermal Interface Material in Building Projects Introduction to Silicone Thermal Interface Materials Silicone thermal interface materials (TIMs) play a pivotal role in enhancing thermal management across various sectors, particularly in construction and building projects. As we push towards more energy-efficient and sustainable building practices, these material

Sep 24,2026

Understanding Thermal Conductive Silicone Caps: Essential for Your Building and Decoration Projects

Thermal conductive silicone caps are specialized components that play a crucial role in various applications within the construction and decoration materials industry. These caps are designed to efficiently dissipate heat, making them invaluable in systems where thermal management is essential. Their unique properties allow them to maintain performance even under extreme temperatures, making them

Sep 19,2026

The Impact of Ceramic Substrates on Power Electronics Reliability: A Comprehensive Analysis

The Impact of Ceramic Substrates on Power Electronics Reliability Table of Contents 1. Introduction to Power Electronics and Ceramic Substrates 2. What Are Ceramic Substrates? 3. Benefits of Ceramic Substrates in Power Electronics 3.1 High Thermal Conductivity 3.2 Excellent Dielectric Properties 3.3 Mechanical Strength and Durability 4. Applications of Ceramic Substrates i

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