THERMAL CONDUCTIVE POTTING ADHESIVE

Themmal conductive potting glue is a low-viscosity two-component silicone pottingmaterial. This product has good fluidity, does not produce small molecules during curing, hasexcellent thermal conducivity and insulation properties after curing, and has no comosion tovarious substrates. it is mainly used for potting of electronic components and circuit boardssuch as driving power supplies. Sensors, photovoltaic jundion boxes, etc,, provide protectionfor electrical/electronic devices and components under severe conditions such as high humidityextreme temperature, themmal cycle stress, mechanical shock and vibration, mold, dirt, etc, nocontact thermal resistance, seamless contact Heat-generating electronic components, heat isconducted from the separation device or the entire PcB to the metal shell or diffusion platethereby improving the efficiency and service life of the heat-generating electronic components.

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Category:

Thermal conductive sealant

Keyword： THERMAL CONDUCTIVE POTTING ADHESIVE

Product Introduction Data Download

Product features

High thermal conductivity, low thermal resistance, good wettability
No settlement, no flow, can fill any uneven gap
Soft, no stress, can be compressed to 0.1 mm thin
The design and application are convenient, and the automatic dispensing can adjust the size of anythickness

Typical applications

Wireless electronic equipment
Communication electronic hardware equipment
Automotive electronic application equipment
Chassis or related heat dissipation module
Host or small office network equipment
Microprocessors, memory chips and graphics processors

Item	LCF080Y Technical Specifications		LCF150Y Technical Specifications		LCF200Y Technical Specifications		Test method
	Component A	Component B	Component A	Component B	Component A	Component B
Appearance	White fluid	Grey fluid	White fluid	Grey fluid	White fluid	Grey fluid	Visual inspection
Viscosity	3000±500	3000±500	7500±500	7000±500	10000±1000	10000±1000	ASTM E3116
Mixing ratio	1:01		1:01		1:01		/
Performance after mixing
Viscosity after mixing	3000mPa·s/25℃		7000mPa·s/25℃		10000mPa·s/25℃		ASTM E3116
Operating Time	60min/25℃		60min/25℃		60min/25℃		ASTM C679
Curing time	480min/25℃		480min/25℃		480min/25℃		/
Performance after curing
Appearance	Gray solid		Gray solid		Gray solid		Visual inspection
Thermal conductivity	0.8±0.08W/m.k		1.5±0.15W/m.k		2.0±0.20W/m.k		ISO22007
Hardness	50±5 ShoreA		50±5 ShoreA		50±5 ShoreA		ASTM D2240
Density	1.62g/cm³±0.05		2.50g/cm³ ±0.05		2.70g/cm³±0.05		ASTM D792
Tensile strength	0.85MPa		0.85MPa		0.85MPa		ASTM D412
Volume resistivity	1×10¹³ Ω · cm		1×10¹³Ω · cm		1.0×10¹³Ω · cm		ASTM D257
Voltage breakdown strength	＞ 15KV/mm		＞ 15KV/mm		＞ 15KV/mm		ASTM D149
Dielectric constant	2.8(@1MHz)		3.7(@1MHz)		4.2(@1MHz)		ASTM D150
Linear expansion coefficient	184μm/（m·℃）		148μm/（m·℃）		124μm/（m·℃）		ASTM E228
Flame retardant performance	V-0		V-0		V-0		Ul94
Operating temperature	-40~200℃		-40~200℃		-40~200℃		/
Specific heat capacity (25 ℃)	1.206 J/(g*K）		0.955 J/(g*K）		0.964J/(g*K）		ASTM E1269

The above performance data were measured after curing at 25℃ and 55% RH for 1 day.

Packaging: components a and B are packed in independent plastic drums, and the package specification is 25kg / 25kg

Storage: it shallbe stored in a cool and dry place without direct sunlight. itis recommended thatthe storage temperature be lowerthan 27℃. it can be stored for 6 months from the production date when it is unopened and wellsealed. During storage,the filer maysettle,which is normal.ltshould be mixed evenly before use.

Thermal conductive potting compound is a specialized material used for encapsulating and protecting electronic components, especially in high-performance applications. This compound is designed to provide excellent heat dissipation, preventing overheating and improving the longevity of sensitive components. It is commonly used in electronics, automotive, and industrial applications, particularly for power modules, LEDs, and sensors. By offering both electrical insulation and thermal conductivity, this potting compound ensures reliable operation in demanding environments, protecting the internal circuitry while enhancing overall system efficiency.

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