ULTRA HIGH THERMAL PAD

Lc500-lc800 high thermal conductivity silicon ﬁlm is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to ﬁll the air gap between the heating device and the he at sink or metal base. Their ﬂexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diﬀusion plate, which can eﬀectively improve the heat dissipation performance and the eﬃciency and service life of the heating electronic components.

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Category:

Thermal PAD

Keyword： ULTRA HIGH THERMAL PAD

Product Introduction Data Download

Product features

Excellent thermal conductivity, high thermal conductivity, low thermal resistance
High fit, soft and elastic
High electrical insulation, protect sensitive electronic devices
Natural stickiness, easy to assemble and disassemble

Typical applications

CPU / memory / high speed hard disk drive
Microprocessors, memory chips and graphics processors
Automobile engine control module
Communication electronic hardware equipment
Military electronic equipment

Item	Unit	LC700	LC800	LC1000	Test method
Color	-	Grey	Grey	Grey	Visual inspection
Thickness	mm	0.5-5.0	0.5-5.0	0.5-5.0	ASTM D374/374M
Hardness	Shore AO	30±5	30±5	20±5	GB/T 531
Hardness	Shore OO	70±10	70±10	70±10	ASTM D2240
Density	g/cm3	3.5	3.55	3.65	ASTM D792
Tensile strength	Mpa	0.15	0.15	0.15	ASTM D412
Elongation at break	%	24	24	15	ASTM D412
Breakdown voltage	KV/mm	≥7	≥7	≥5	ASTM D149
Volume resistivity	Ω·cm	1×1011	1×1011	1×1011	ASTM D257
Temperature resistance range	℃	-40~150	-40~150	-40~150	-
Fire resistance	-	V-0	V-0	V-0	UL 94
Weight loss	%	≤0.2	≤0.2	≤0.5	@150℃240H
Dielectric constant	@1MHz	8	8	7.32	ASTM D150
Thermal conductivity	W/m · K	7	8	10	ISO 22007-2
Thermal conductivity	W/m · K	7	8	10	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃·in2/W	0.204	0.207	0.167	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃·cm2/W	1.315	1.337	1.077	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K)	0.903	0.722	0.786	ASTM E1269

Basic specification: 200mm *400mm, can be cut into specific shape and size according to the use reguirements. Glass fiber base material / silicon back adhesive / back adhesive can be selected.

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