HIGH THERMAL PAD

High thermal conductivity silicon ﬁlm is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-eﬀective thermal insulation ﬁlling material with natural micro viscosity and softness on the surface, which can fully ﬁll the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.

Product Inquiry

Category:

Thermal PAD

Keyword： HIGH THERMAL PAD

Product Introduction Data Download

Product features

Cost effective,highthermalconductivitylow thermal resistance
High fit, soft and elastic
High electricalinsulation, protect sensitiveelectronic devices
Natural stickiness,easy to assemble anddisassemble

Typical applications

CPU/memory/high speed hard disk drive
Microprocessors,memory chips and graphicsprocessors
Newenergy vehicles and peripheral/charging machines
Networkcommunication equipment
Heating module with high heat conductiondemand

Item	Unit	LC400	LC500	LC600	Test method
Color	-	grey	grey	grey	Visual inspection
Thickness	mm	0.3-15	0.3-15	0.3-15	ASTM D374/374M
Hardness	Shore AO	30±5	30±5	30±5	GB/T531
Hardness	Shore OO	60±10	60±10	60±10	ASTM D2240
Density	g/cm3	2.07±0.2	2.79±0.2	3.07±0.2	ASTM D792
Tensile strength	Mpa	0.22	0.23	0.16	ASTM D412
Elongation at break	%	220	110	90	ASTM D412
Breakdown voltage	KV/mm	≥10	≥10	≥10	ASTM D149
Volume resistivity	Ω·cm	≥1×1013	≥1×1013	≥1×10	ASTM D257
Temperature resistance range	℃	-40~150	-40~200	-40~200	-
Fire resistance	-	V-0	V-0	V-0	UL 94
Weight loss	%	≤0.5	≤0.3	≤0.3	@150℃240H
Dielectric constant	@1MHz	4.09	4.84	6.04	ASTM D150
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ISO 22007-2
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃ · in2/W	1.441	0.921	0.586	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃ · cm2/W	9.297	5.939	3.779	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K）	1.039	0.938	0.952	ASTM E1269

Basic specification: 200mm *400mm, can be cut into specific shape and size according to the use requirements. Glassfiber base material/ silicon back adhesive / back adhesive can be selected

More Products

Aluminum nitride ceramic sheet LT1800

LT1800 aluminum nitide (AIN)thermal conductive ceramic shet is a high-peformance thermal insulation material with an exceptionally highthermal conductivity(180 W/m K)and excellent electrical insulation properties.It can operate stably over the long term under high-temperatureconditions.With a thermal expansion coeficient close to that of silicon,it is particularly wellsuited for applications requiring stringent heatdissipation and electrical isolation,such as power semiconductors,LED lighting,RF microwave devices,and electric vehicles.Additionally,thismaterial offers outstanding chemical stability,making it capable of withstanding harsh industrial environments.It is an ideal thermal managementsolution for modern high-power electronic devices.

Learn More

Thermal Silicone Cloth LCV200S

The LCV200S thermal silicone cloth is a fabric-like product made fromsilicone and fiberglass using a specialized manufacturing process.Due to itsexcellent thermal conductivity,insulation properties,and ease of assembly,it is widely used in industries such as electronics and electricalappliances.During use,different thicknesses of thermal silicone sheets are selected and cut according to the size and gap height of theheat-generating interface,and installed in the gap between the heat source and its heat dissipation component to provide thermal conductivity andinsulation.

Learn More

THERMAL CONDUCTIVE SILICONE CAP

LCV100U series thermal conductive silicone cap sleeve is a sleeve product produced by special process with high polymer and ceramic thermal conductive powder. Because of its excellent heat conduction, insulation, shockproof and convenient assembly, it is widely used in heating transistors, diodes and triodes. When in use, it is directly installed on the heating pipe. LCU series thermal conductive silicone cap sleeve is recommended to be used at low stress.

Learn More

CERAMIC HEAT SINK

Ceramic heat sink is a green environmental protection material. It belongs to microporous structure, which can increase he porosity by 30% under he same unit area, greatly increasing he heat dissipation area in contact with air and enhancing its heat dissipation eﬀect. At the same time, its heat capacity is small, its own heat storage capacity is small, and its heat can be transmitted to the outsideworld morequickly.The maincharacteristicsofceramic heatsinkareenvironmental protection, insulation, high voltage resistance, eﬃcient heat dissipation, and avoiding EMI problems. It can eﬀectively solve the heat conduction and heat dissipation problems in the electronics and home appliance industries.Atthe sametime, it is especialy suitable for products with smal and medium wat power consumption and light, thin, short and small design space. It can provide technical support and application for the innovation and development of electronic products.

Learn More