HIGH THERMAL PAD

High thermal conductivity silicon ﬁlm is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-eﬀective thermal insulation ﬁlling material with natural micro viscosity and softness on the surface, which can fully ﬁll the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.

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Category:

Thermal PAD

Keyword： HIGH THERMAL PAD

Product Introduction Data Download

Product features

Cost effective,highthermalconductivitylow thermal resistance
High fit, soft and elastic
High electricalinsulation, protect sensitiveelectronic devices
Natural stickiness,easy to assemble anddisassemble

Typical applications

CPU/memory/high speed hard disk drive
Microprocessors,memory chips and graphicsprocessors
Newenergy vehicles and peripheral/charging machines
Networkcommunication equipment
Heating module with high heat conductiondemand

Item	Unit	LC400	LC500	LC600	Test method
Color	-	grey	grey	grey	Visual inspection
Thickness	mm	0.3-15	0.3-15	0.3-15	ASTM D374/374M
Hardness	Shore AO	30±5	30±5	30±5	GB/T531
Hardness	Shore OO	60±10	60±10	60±10	ASTM D2240
Density	g/cm3	2.07±0.2	2.79±0.2	3.07±0.2	ASTM D792
Tensile strength	Mpa	0.22	0.23	0.16	ASTM D412
Elongation at break	%	220	110	90	ASTM D412
Breakdown voltage	KV/mm	≥10	≥10	≥10	ASTM D149
Volume resistivity	Ω·cm	≥1×1013	≥1×1013	≥1×10	ASTM D257
Temperature resistance range	℃	-40~150	-40~200	-40~200	-
Fire resistance	-	V-0	V-0	V-0	UL 94
Weight loss	%	≤0.5	≤0.3	≤0.3	@150℃240H
Dielectric constant	@1MHz	4.09	4.84	6.04	ASTM D150
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ISO 22007-2
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃ · in2/W	1.441	0.921	0.586	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃ · cm2/W	9.297	5.939	3.779	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K）	1.039	0.938	0.952	ASTM E1269

Basic specification: 200mm *400mm, can be cut into specific shape and size according to the use requirements. Glassfiber base material/ silicon back adhesive / back adhesive can be selected

High temperature thermal pad is engineered to deliver reliable heat dissipation and thermal management in demanding high-heat environments. Made from advanced silicone-based or composite materials, it provides excellent thermal conductivity while maintaining electrical insulation and mechanical stability. These pads are capable of operating under extreme temperatures without deformation, cracking, or performance loss, ensuring long-term reliability in critical applications.

The pad’s soft and flexible structure allows it to conform to uneven surfaces, minimizing air gaps and enhancing heat transfer efficiency between heat-generating components and heat sinks. It is widely used in power electronics, automotive systems, LED lighting, communication equipment, and industrial machinery where consistent thermal control is essential.

With strong resistance to aging, oxidation, and environmental stress, high temperature thermal pads offer a durable and maintenance-free solution. Easy to install and available in various thicknesses and thermal conductivity ratings, they provide an efficient, safe, and cost-effective way to improve system performance and extend the lifespan of electronic devices.

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