Thermal conductive sealant

Thermal conductive silicon

Thermal conductive silicon

Thermal conductive silica gel is a semi-flowing thermal conductive silicone adhesive made of special silicone rubber material as the base material and thermal conductive powder. It has excellent thermal conductivity, excellent high and low temperature resistance, good adhesion, long-term use will not fall off, will not produce contact cracks, moisture proof, seismic resistance, corona resistance, leakage resistance and aging resistance. Widely used for bonding and sealing of electronic components with high thermal conductivity requirements, in accordance with ROHS REACH Ul

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THERMAL GREASE

THERMAL GREASE

Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It is suitable for interface heat conduction of general CPU, GPU and other heating power devices. Because of its low viscosity, it can fully wet the contact surface and form a low interface thermal resistance, so it can quickly and efficiently transfer heat to the heat dissipation device and apply it on the assembly surface of power device and radiator to help eliminate the air gap on the contact surface, increase the heat flow, reduce the thermal resistance, reduce the working temperature of power device, improve the reliability and prolong the service life.

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HIGH THERMAL CONDUCTIVE POTTING ADHESIVE

HIGH THERMAL CONDUCTIVE POTTING ADHESIVE

Themmal conductive potting glue is a low-viscosity two-component silicone pottingmaterial. This product has good fluidity, does not produce small molecules during curing, hasexcellent thermal conducivity and insulation properties after curing, and has no comosion tovarious substrates. it is mainly used for potting of electronic components and circuit boardssuch as driving power supplies. Sensors, photovoltaic jundion boxes, etc,, provide protectionfor electrical/electronic devices and components under severe conditions such as high humidityextreme temperature, themmal cycle stress, mechanical shock and vibration, mold, dirt, etc, nocontact thermal resistance, seamless contact Heat-generating electronic components, heat isconducted from the separation device or the entire PcB to the metal shell or diffusion platethereby improving the efficiency and service life of the heat-generating electronic components.

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THERMAL CONDUCTIVE POTTING ADHESIVE

THERMAL CONDUCTIVE POTTING ADHESIVE

Themmal conductive potting glue is a low-viscosity two-component silicone pottingmaterial. This product has good fluidity, does not produce small molecules during curing, hasexcellent thermal conducivity and insulation properties after curing, and has no comosion tovarious substrates. it is mainly used for potting of electronic components and circuit boardssuch as driving power supplies. Sensors, photovoltaic jundion boxes, etc,, provide protectionfor electrical/electronic devices and components under severe conditions such as high humidityextreme temperature, themmal cycle stress, mechanical shock and vibration, mold, dirt, etc, nocontact thermal resistance, seamless contact Heat-generating electronic components, heat isconducted from the separation device or the entire PcB to the metal shell or diffusion platethereby improving the efficiency and service life of the heat-generating electronic components.

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TWO COMPONENT THERMAL CONDUCTIVE GEL

TWO COMPONENT THERMAL CONDUCTIVE GEL

Two component thermal conductive gel is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible and thermally conductive elastomer,which is formed with the shape of the structure. After curing, it is equivalent to the thermal conductive silicone gasket. It mainly meets the requirements of low pressure and high compression modulus. It can realize automatic dispensing production with high efficiency. It has good contact with electronic products, increases effective contact area and reduces contact thermal resistance. It can automatically fill the gap and compress infinitely. It is suitable for heat dissipation modules or electronic components with large thickness variation.

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ONE-PART THERMAL CONDUCTIVE GEL

ONE-PART THERMAL CONDUCTIVE GEL

Single component thermal conductive gel is a kind of thermal conductive material with lower deformation force. It has similar plasticity of plasticized, non flowing, high thermal conductivity and low thermal resistance. It has good insulation, good insulation, and can fill the gap automatically, so that the contact area can reach full contact. It can be applied to the heat dissipation module or electronic component with larger thickness. Unlike thermal conductive silicone grease, heat conductive gel has no sedimentation and no flow phenomenon. It is suitable for screen printing or scraping. The syringe packaging can be dispensed on standard dispensing equipment, so as to effectively improve operation convenience and efficiency.

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