LOW SPECIFIC GRAVITY LOW DIELECTRIC THERMAL PAD

Low speciﬁc gravity and low dielectric conductivity hot silicon ﬁlm is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can eﬀectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely ﬁll the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.

Product Inquiry

Category:

Thermal PAD

Keyword： LOW SPECIFIC GRAVITY LOW DIELECTRIC THERMAL PAD

Product Introduction Data Download

Product features

High thermal conductivity, low thermal resistance and low specific gravity
Low dielectric constant, low dielectric loss
Low pressure applications to protect sensitive electronic components
Natural stickiness, easy to assemble and rework

Typical applications

UAV intelligent equipment
5g mobile communication electronic equipment
Network communication electronics
Automotive electronics
Smart wearable devices

Item	Unit	LC300BN	Test method
Color	-	Grayish-white	Visual inspection
Thickness	mm	0.5-5	ASTM D374/374M
Hardness	Shore AO	40±5	GB/T531
Hardness	Shore OO	65±10	ASTM D2240
Density	g/cm3	1.39	ASTM D792
Temperature resistance range	℃	-40~120	-
Fire resistance	-	V-0	UL 94
Weight loss	%	≤0.5	@150℃240H
Tensile strength	Mpa	0.24	ASTM D412
Elongation at break	%	40	ASTM D412
Tear strength	KN/m	0.5	ASTM D624
Breakdown voltage	KV/mm	≥10	ASTM D149
Volume resistivity	Ω·cm	1×1013	ASTM D257
Dielectric constant	@1MHz	3.24	ASTM D150
Dielectric loss	@1MHz	≤0.001	ASTM D150
Thermal conductivity	W/m · K	3	ISO 22007-2
Thermal conductivity	W/m · K	3	ASTM D5470
Thermal resistance	℃·in2/W	0.591	ASTM D5470
Thermal resistance	℃·cm2/W	3.812	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K)	1.331	ASTM E1269

Basic specification: 200 mm * 400 mm, can be cut into specific shape and size according to the use demand.

More Products

Aluminum nitride ceramic sheet LT1800

LT1800 aluminum nitide (AIN)thermal conductive ceramic shet is a high-peformance thermal insulation material with an exceptionally highthermal conductivity(180 W/m K)and excellent electrical insulation properties.It can operate stably over the long term under high-temperatureconditions.With a thermal expansion coeficient close to that of silicon,it is particularly wellsuited for applications requiring stringent heatdissipation and electrical isolation,such as power semiconductors,LED lighting,RF microwave devices,and electric vehicles.Additionally,thismaterial offers outstanding chemical stability,making it capable of withstanding harsh industrial environments.It is an ideal thermal managementsolution for modern high-power electronic devices.

Learn More

Thermal Silicone Cloth LCV200S

The LCV200S thermal silicone cloth is a fabric-like product made fromsilicone and fiberglass using a specialized manufacturing process.Due to itsexcellent thermal conductivity,insulation properties,and ease of assembly,it is widely used in industries such as electronics and electricalappliances.During use,different thicknesses of thermal silicone sheets are selected and cut according to the size and gap height of theheat-generating interface,and installed in the gap between the heat source and its heat dissipation component to provide thermal conductivity andinsulation.

Learn More

THERMAL CONDUCTIVE SILICONE CAP

LCV100U series thermal conductive silicone cap sleeve is a sleeve product produced by special process with high polymer and ceramic thermal conductive powder. Because of its excellent heat conduction, insulation, shockproof and convenient assembly, it is widely used in heating transistors, diodes and triodes. When in use, it is directly installed on the heating pipe. LCU series thermal conductive silicone cap sleeve is recommended to be used at low stress.

Learn More

CERAMIC HEAT SINK

Ceramic heat sink is a green environmental protection material. It belongs to microporous structure, which can increase he porosity by 30% under he same unit area, greatly increasing he heat dissipation area in contact with air and enhancing its heat dissipation eﬀect. At the same time, its heat capacity is small, its own heat storage capacity is small, and its heat can be transmitted to the outsideworld morequickly.The maincharacteristicsofceramic heatsinkareenvironmental protection, insulation, high voltage resistance, eﬃcient heat dissipation, and avoiding EMI problems. It can eﬀectively solve the heat conduction and heat dissipation problems in the electronics and home appliance industries.Atthe sametime, it is especialy suitable for products with smal and medium wat power consumption and light, thin, short and small design space. It can provide technical support and application for the innovation and development of electronic products.

Learn More