HEAT CONDUCTION RADIO ABSORBING PAD

Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.

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Category:

Thermal PAD

Keyword： HEAT CONDUCTION RADIO ABSORBING PAD

Product Introduction Data Download

Product features

Dual advantages of radio absorbing and heat conduction
Double sided self-adhesive, easy to assemble and reusable
Stable reflection loss performance and high peak absorption strength
Fire rating reaches UL94 V0
High insulation strength

Typical applications

Commercial communication: antenna/base station/ optical module/router/switch, etc
Millimeter wave application: 5G communication/ millimeter wave radar
Industrial electronics: automotive electronics/UAV, etc
Instrument measurement: power amplifier/filter/ test system
Security and national defense: radar system/ aerospace, etc

Item	Unit	LC700	LC800	Test method
Color	-	Grey	Grey	Visual inspection
Thickness	mm	0.5-10	0.5-10	ASTM D374/374M
Hardness	Shore AO	30±5	30±5	GB/T 531
Hardness	Shore OO	60±10	60±10	ASTM D2240
Density	g/cm3	4.39	4.11	ASTM D792
Temperature resistance range	℃	-40~150	-40~150	-
Fire resistance	-	V-0	V-0	UL 94
Weight loss	%	≤0.3	≤0.3	@150℃240H
Tensile strength	Mpa	≥0.2	≥0.2	ASTM D412
Elongation at break	%	≥100	≥50	ASTM D412
Tear strength	KN/m	1	1	ASTM D624
Breakdown voltage	V/mm	≥250	≥250	ASTM D149
Dielectric constant	@1MHz	13	8.3	ASTM D150
Dielectric loss	@1MHz	7.6x10-4	5.1x10-4	ASTM D150
Thermal conductivity	W/m · K	2.0±0.2	3.0±0.3	ISO 22007-2
Thermal conductivity	W/m · K	2.0±0.2	3.0±0.3	ASTM D5470
Use frequency band	GHz	As shown in the figure	As shown in the figure	GJB 2038A-2011
Specific heat capacity (25 ℃)	J/(g*K)	0.613	0.567	ASTM E1269

Basic specification: 200mm * 400mm, which can be cut into specific shape and size according to use requirements

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