Products
Aluminum nitride ceramic sheet LT1800
LT1800 aluminum nitide (AIN)thermal conductive ceramic shet is a high-peformance thermal insulation material with an exceptionally highthermal conductivity(180 W/m K)and excellent electrical insulation properties.It can operate stably over the long term under high-temperatureconditions.With a thermal expansion coeficient close to that of silicon,it is particularly wellsuited for applications requiring stringent heatdissipation and electrical isolation,such as power semiconductors,LED lighting,RF microwave devices,and electric vehicles.Additionally,thismaterial offers outstanding chemical stability,making it capable of withstanding harsh industrial environments.It is an ideal thermal managementsolution for modern high-power electronic devices.
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Thermal Silicone Cloth LCV200S
The LCV200S thermal silicone cloth is a fabric-like product made fromsilicone and fiberglass using a specialized manufacturing process.Due to itsexcellent thermal conductivity,insulation properties,and ease of assembly,it is widely used in industries such as electronics and electricalappliances.During use,different thicknesses of thermal silicone sheets are selected and cut according to the size and gap height of theheat-generating interface,and installed in the gap between the heat source and its heat dissipation component to provide thermal conductivity andinsulation.
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THERMAL CONDUCTIVE SILICONE CAP
LCV100U series thermal conductive silicone cap sleeve is a sleeve product produced by special process with high polymer and ceramic thermal conductive powder. Because of its excellent heat conduction, insulation, shockproof and convenient assembly, it is widely used in heating transistors, diodes and triodes. When in use, it is directly installed on the heating pipe. LCU series thermal conductive silicone cap sleeve is recommended to be used at low stress.
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CERAMIC HEAT SINK
Ceramic heat sink is a green environmental protection material. It belongs to microporous structure, which can increase he porosity by 30% under he same unit area, greatly increasing he heat dissipation area in contact with air and enhancing its heat dissipation effect. At the same time, its heat capacity is small, its own heat storage capacity is small, and its heat can be transmitted to the outsideworld morequickly.The maincharacteristicsofceramic heatsinkareenvironmental protection, insulation, high voltage resistance, efficient heat dissipation, and avoiding EMI problems. It can effectively solve the heat conduction and heat dissipation problems in the electronics and home appliance industries.Atthe sametime, it is especialy suitable for products with smal and medium wat power consumption and light, thin, short and small design space. It can provide technical support and application for the innovation and development of electronic products.
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ALN CERAMIC PAD
Thethermal conductivity ofAlN ceramic sheet is180W/m.k,which is7-10times ofthat of alumina ceramic. Excellent mechanical properties,good machinability, high dimensional accuracy,smooth surface, no micro cracks, bending and so on. Low dielectric constant and dielectric loss, reliable electrical insulation performance. It is nontoxic, 1800 ℃ resistant, ol resistant, chemical resistant, and has the same coefficient of thermal expansion as slicon, no hygroscopicity, and stable perfo mance under high temperature and high humidity conditions.With he wide development of microelectronic equipment, high thermal conductivity AlN ceramic chip as a matrix material or packaging material has beenwidelyvalued and applied.
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THERMALCONDUCTIVECERAMICSHEET
The thermal conductivity of the ceramic sheet is as high as 24W / M.k. it is resistant to high temperature and high pressure. The surface of the ceramic sheet is smooth without burr and burr. lit is heated evenly and dissipates heat quidkly, Simple and compact structure, small size. high strength, not easy to break, acid and alkali comosion resistance, durable
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LCK -10 SILICON PAD
Lck-10 is a kind of high performance insulating material coated with silicone rubber based on polyimide film,which has excellent puncture resistance and excellent thermal conductivity. Lck-10 is specially designed as a substitute for ceramic insulators such as beryllium oxide, boron nitride and bauxite. Ceramic insulator is more expensive and easy to damage. In contrast, lck-10 is not easy to damage and has lower cost.
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HIGH THERMAL CONDUCTIVITY SILICONE PAD
High thermal conductivity silicon fil m is a thin thermal insulation material with excellent comprehensive performance, which is made of glass fiber as the base material, heat conduction powder and high polymer, and is synthesized by special process. This material has high thermal conductivity, high friction resistance, high tensile strength, smooth and highly adherent surface and other advantages, which enable it to significantly reduce the interface thermal resistance under low pressure. It is widely used in occasions where high thermal conductivity and high electrical insulation are required. It is mainly used between the heating semiconductor device and the heat dissipation substrate for heat conduction and insulation.
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THERMAL CONDUCTIVE SILICON FILM
Thermal conductive silicone tape is a cloth like product made of silica gel and glass fiber through special process. Because of its excellent heat conduction, insulation and easy assembly, it is widely used in electronic and electrical industries. When in use, thermal conductive silicon films of different thickness are selected according to the size of the heating interface and the height of the gap, and are installed in the gap between the heating interface and its heat dissipation components to play the role of thermal insulation.
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Thermal conductive silicon
Thermal conductive silica gel is a semi-flowing thermal conductive silicone adhesive made of special silicone rubber material as the base material and thermal conductive powder. It has excellent thermal conductivity, excellent high and low temperature resistance, good adhesion, long-term use will not fall off, will not produce contact cracks, moisture proof, seismic resistance, corona resistance, leakage resistance and aging resistance. Widely used for bonding and sealing of electronic components with high thermal conductivity requirements, in accordance with ROHS REACH Ul
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THERMAL GREASE
Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It is suitable for interface heat conduction of general CPU, GPU and other heating power devices. Because of its low viscosity, it can fully wet the contact surface and form a low interface thermal resistance, so it can quickly and efficiently transfer heat to the heat dissipation device and apply it on the assembly surface of power device and radiator to help eliminate the air gap on the contact surface, increase the heat flow, reduce the thermal resistance, reduce the working temperature of power device, improve the reliability and prolong the service life.
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THERMAL CONDUCTIVE POTTING ADHESIVE
Themmal conductive potting glue is a low-viscosity two-component silicone pottingmaterial. This product has good fluidity, does not produce small molecules during curing, hasexcellent thermal conducivity and insulation properties after curing, and has no comosion tovarious substrates. it is mainly used for potting of electronic components and circuit boardssuch as driving power supplies. Sensors, photovoltaic jundion boxes, etc,, provide protectionfor electrical/electronic devices and components under severe conditions such as high humidityextreme temperature, themmal cycle stress, mechanical shock and vibration, mold, dirt, etc, nocontact thermal resistance, seamless contact Heat-generating electronic components, heat isconducted from the separation device or the entire PcB to the metal shell or diffusion platethereby improving the efficiency and service life of the heat-generating electronic components.
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