THERMAL PAD

LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be eﬀectively improved, so as to eﬀectively improve the heat dissipation effect.

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Thermal PAD

Keyword： THERMAL PAD

Product Introduction Data Download

Product features

Low cost, high efficiency,high costperformance
Thermal conductive silicone grease to replace volatile pollution
Naturalstickiness, easy assembly, repeatable disassembly
Wide thickness range, can fillany uneven size gap
High electricalinsu lation

Typical applications

Computer / communication equipment
Laptop / tablet / PC server
New energy power battery / vehicle equipment
Switching power supply / UPS
Video / security equipment
Any heating element and radiator

Item	Unit	LC120	LC200	LC300	Test method
Color	-	Grey white / Blue / Black	Blue	Blue	Visual inspection
Thickness	mm	0.3-15	0.3-15	0.3-15	ASTM D374/374M
Hardness	Shore AO	30±5	30±5	30±5	GB/T531
Hardness	Shore OO	60±10	60±10	60±10	ASTM D2240
Density	g/cm3	2.07±0.2	2.79±0.2	3.07±0.2	ASTM D792
Tensile strength	Mpa	0.22	0.23	0.16	ASTM D412
Elongation at break	%	220	110	90	ASTM D412
Breakdown voltage	KV/mm	≥10	≥10	≥10	ASTM D149
Volume resistivity	Ω·cm	≥1×1013	≥1×1013	≥1×10	ASTM D257
Temperature resistance range	℃	-40~150	-40~200	-40~200	-
Fire resistance	-	V-0	V-0	V-0	UL 94
Weight loss	%	≤0.5	≤0.3	≤0.3	@150℃240H
Dielectric constant	@1MHz	4.09	4.84	6.04	ASTM D150
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ISO 22007-2
Thermal conductivity	W/m · K	1.2±0.12	2.0±0.2	3.0±0.3	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃·in2/W	1.441	0.921	0.586	ASTM D5470
Thermal impedance(50℃/10psi/1mm)	℃ · cm2 /W	9.297	5.939	3.779	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K）	1.039	0.938	0.952	ASTM E1269

Basic specification: 2oomm*4oomm, can be cut into specific shape and size according to the use requirements. Glass fiber base material / silicon back adhesive/ back adhesive can be selected.

Thermal Pad is a high-performance, electrically insulating interface material designed to improve heat dissipation between electronic components and heatsinks. Made from premium thermally conductive materials, it efficiently transfers heat away from CPUs, GPUs, power modules, and other high-temperature devices, preventing overheating and ensuring stable operation. Flexible and easy to install, thermal pads conform to irregular surfaces, filling gaps and providing consistent thermal conductivity. Resistant to aging, vibration, and compression, they are ideal for computers, LED lighting, automotive electronics, and industrial applications where reliable heat management is essential.

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