THERMALCONDUCTIVECERAMICSHEET

The thermal conductivity of the ceramic sheet is as high as 24W / M.k. it is resistant to high temperature and high pressure. The surface of the ceramic sheet is smooth without burr and burr. lit is heated evenly and dissipates heat quidkly, Simple and compact structure, small size. high strength, not easy to break, acid and alkali comosion resistance, durable

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Category:

Thermal conductive ceramic sheet / heat sink

Keyword： THERMALCONDUCTIVECERAMICSHEET

Product Introduction Data Download

Product features

Superior chemical and mechanical stability
High hardness, high wear resistance
High thermal conductivity, high electrical insulation
Effective anti-interference (EMI), anti-static

Typical applications

IC / MOS / triode
Surface heat source for diode and IGBT
High density switching power supply
High frequency communication equipment
High frequency welding machine and other equipment

Test Item	Unit	LT240 (96% Alumina)	Testing standards
Color	-	White	-
Density	g/cm³	3.70	GB/T 2413
Thermal conductivity (25°C)	W/m·K	24	ISO 22007-2
Dielectric constant	1MHz	9-10	GB/T 5594.4
Dielectric strength	KV/mm	≥15	GB/T 5593
Flexural strength	MPa	≥300	GB/T 5593
Warpage	%	≤2
Surface roughness	μm	0.2–0.75	GB/T6062
Water absorption rate	%	0	GB/T 3299
Volume Resistivity (20°C)	Ω·cm	≥10¹⁴	GB/T5594.5
Coefficient of thermal expansion	10⁻⁶°C⁻¹ (20–300°C)	6.5–7.5
Coefficient of thermal expansion	10-6°C⁻¹ (300–800°C)	6.5–8.0	GB/T5594.3

Conventional thickness:0.3MM,0.38MM,0.5MM,0.635MM, 0.76MM,0.8MM,1.0MM, 1.2MM,1.5MM,2.0MM

Basic specifications: TO-220, TO-247, to-264, to-3p and other conventional MOS tube fit size, non-standard size can be customized

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