THERMAL CONDUCTIVE SILICONE CAP
Category:
Insulated and thermally conductive silicone products
Keyword: THERMAL CONDUCTIVE SILICONE CAP
Product features
- Excellent thermal conductivity and insulation
- High strength, high toughness, compression resistance
- Easy to use and can be disassembled repeatedly
Typical applications
- Heating transistor, diode
- Audion,IGBT mosfet
| Test Item | Unit | LCV100U Thermal Conductivity Cap Sleeve | Testing Method | ||||||
| Material | - | Silicone + Ceramic | |||||||
| Color | - | Gray/Blue | Visual | ||||||
| Density | g/cm³ | 1.8 | ASTM D792 | ||||||
| Hardness | Shore A | 70 ± 5 | ASTM 2240 | ||||||
| Tensile strength | Kgf/cm² | 30 ± 3 | ASTN D412 | ||||||
| Temperature resistance range | °C | -40 to +200 | - | ||||||
| Voltage Resistance | KV | 5.0 | ASTM D149 | ||||||
| Thermal conductivity | W/m·K | 1.0 | ASTM D5470 | ||||||
| Model and Specifications | ||||||||||
| TO-220A | TO-220B | TO-220C | TO-3PA | TO-3PB | TO-3PC | |||||
| DIM A | 21.5 ± 0.3 | 16.0 ± 0.3 | 21.8 ± 0.5 | 28.5 ± 0.3 | 28.8 ± 0.5 | 22.0 ± 0.3 | ||||
| DIM B | 11.5 ± 0.25 | 11.5 ± 0.25 | 12.1 ± 0.5 | 17.5 ± 0.3 | 18.2 ± 0.5 | 17.5 ± 0.3 | ||||
| DIM C | 5.9 ± 0.2 | 5.9 ± 0.2 | 6.5 ± 0.3 | 5.9 ± 0.2 | 6.6 ± 0.3 | 5.9 ± 0.2 | ||||
| DIM D | 0.5 ± 0.1 | 0.5 ± 0.1 | 0.8 ± 0.1 | 0.5 ± 0.1 | 0.8 ± 0.1 | 0.5 ± 0.1 | ||||
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