Thermal conductive silicon

Thermal conductive silica gel is a semi-ﬂowing thermal conductive silicone adhesive made of special silicone rubber material as the base material and thermal conductive powder. It has excellent thermal conductivity, excellent high and low temperature resistance, good adhesion, long-term use will not fall oﬀ, will not produce contact cracks, moisture proof, seismic resistance, corona resistance, leakage resistance and aging resistance. Widely used for bonding and sealing of electronic components with high thermal conductivity requirements, in accordance with ROHS REACH Ul

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Thermal conductive sealant

Keyword： Thermal conductive silicon

Product Introduction Data Download

Product features

Excellent thermal conductivity and insulation
Good adhesion and sealing, no falling off after long-term use
Moisture proof, earthquake resistant and corona resistant
Excellent temperature resistance

Typical applications

Heat conduction bonding and sealing of high-power LED lamps, power supplies, microwave ovens, electronic components and other industrial products can replace heat conduction silicone grease for heat conduction filling, bonding and fixing between high-power electrical modules and radiators without buckle screws, which brings more reliable filling and heat dissipation, simpler process and more economic cost.

	Item	Unit	LCF1901	LCF1910	LCF1920	LCF1944
Before solidification	Appearance	-	White / half flowing	White/creamy	White/creamy	White/creamy
	Relative density	g/cm3	1.62±0.1	1.82±0.1	2.7±0.1	1.42±0.1
	Extrusion rate	g/min min	-	-	-	＞ 120（φ 3.18mm/0.62MPa)
	Surface drying time	min	5-20	5-20	5-20	10-20
	Full curing time curing type	d	3-7	3-7	3-7	3-7
	Full curing time curing type	d	Single component dealcoholization type	Single component dealcoholization type	Single component dealcoholization type	Single component dealcoholization type
After solidification	Tensile strength	MPa	≥2.0	≥2.0	≥3.3	≥2.2
	Elongation at break	%	＞70	＞60	＞22	＞300
	Hardness	Shore A	55±5	65±5	78±5	32±5
	Shear strength	MPa	≥2.0	≥2.0	≥1.0	≥2.3
	Thermal conductivity	W/m · K	0.6	1.0±0.1	2.0±0.2	0.4±0.2
	Volume resistivity	Ω·cm	1×10¹⁴	1×10¹⁴	1×10¹⁴	1×10¹⁴
	Dielectric strength	kV/ · mm	≥15	≥15	≥15	≥15
	Temperature resistance range	℃	-60~200	-60~200	-60~200	-60~200

The above performance data are measured after curing at 25℃ and 55% relative humidity for 7 days.

Package specification: 100ml / 100 pcs / box, 300ml / 25 PCS / box, 2.6l/4 PCS / box

Storage: This product should be stored in a cool and dry environment below 35 ° C, and the storage period is 6 months below 25℃.

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