THERMAL GREASE

Thermal conductive silicone grease has excellent thermal conductivity, good reliability, and reliable wettability on copper and aluminum surfaces. It is suitable for interface heat conduction of general CPU, GPU and other heating power devices. Because of its low viscosity, it can fully wet the contact surface and form a low interface thermal resistance, so it can quickly and eﬃciently transfer heat to the heat dissipation device and apply it on the assembly surface of power device and radiator to help eliminate the air gap on the contact surface, increase the heat ﬂow, reduce the thermal resistance, reduce the working temperature of power device, improve the reliability and prolong the service life.

Product Inquiry

Category:

Thermal conductive sealant

Keyword： THERMAL GREASE

Product Introduction Data Download

Product features

The wettability of the surface can effectively reduce the thermal resistance of the interface
Low volatile, long-lasting paste state
Precision viscosity, easy to scrape, easy to operate
Environmental protection raw materials, no harmful gas release

Typical applications

Between CPU / GPU and radiator
Between power supply resistor and bottom seat
Thermoelectric cooling device
Temperature regulator and assembly surface
LED lighting and other industries

Item	Unit	LE100	LE200	LE300	LE380	LE006 low thermal resistance	LE003 low thermal resistance	Test method
Color	-	White	White/Grey	White/Grey	灰色	Grey	White/Grey	Visual inspection
Density	g/cm3	1.94	2.9	3.09	2.94	2.87	3	ASTM D792
Temperature resistance range	℃	-40~150	-40~150	-40~150	-40~150	-40~150	-40~150	-
Weight loss	%	≤0.3	≤0.3	≤0.3	≤0.3	≤0.3	≤0.3	@150℃240H
Withstand voltage	KV/mm	≥6	≥6	≥5	≥5	≥8	≥8	ASTM D149
BLT (Adhesive layer thickness)	μ m	≤20	≤30	≤50	≤60	≤20	≤20	-
Dielectric constant	@1MHz	4.24	6.34	7	5.73	6.93	4.88	ASTM D150
Dielectric loss	@1MHz	1.82×10-2	4.27×10-3	2.99×10-3	2.88×10-3	1.37×10-3	2.10E-03	ASTM D150
Viscosity	Pa · s	40±5	190±10	1030				ASTM E3116
Thermal conductivity	W/m · K	1	2	2.71	3.8	5	3	ISO 22007-2
Thermal conductivity	W/m · K	1	2	2.71	3.8	5	3	ASTM D5470
Thermal impedance	℃·in2/W	0.017	0.017	0.016	0.043	0.008	0.004	ASTM D5470
Thermal impedance	℃·cm2/W	0.11	0.11	0.109	0.283	0.057	0.03	ASTM D5470
Specific heat capacity (25 ℃)	J/(g*K)	1.084	0.824	0.807	0.846	0.887	0.966	ASTM E1269

Conventional packaging: 1kg / can, 5kg / can, 10kg / barrel, 20kg / barrel

Note: the above electrical performance data are the thermal impedance measured after the curing tablet is formed and the thermal impedance is 0.1mm thick, of which le003 and le006 thermal impedance parameter is the test value of limit thickness.

More Products

Aluminum nitride ceramic sheet LT1800

LT1800 aluminum nitide (AIN)thermal conductive ceramic shet is a high-peformance thermal insulation material with an exceptionally highthermal conductivity(180 W/m K)and excellent electrical insulation properties.It can operate stably over the long term under high-temperatureconditions.With a thermal expansion coeficient close to that of silicon,it is particularly wellsuited for applications requiring stringent heatdissipation and electrical isolation,such as power semiconductors,LED lighting,RF microwave devices,and electric vehicles.Additionally,thismaterial offers outstanding chemical stability,making it capable of withstanding harsh industrial environments.It is an ideal thermal managementsolution for modern high-power electronic devices.

Learn More

Thermal Silicone Cloth LCV200S

The LCV200S thermal silicone cloth is a fabric-like product made fromsilicone and fiberglass using a specialized manufacturing process.Due to itsexcellent thermal conductivity,insulation properties,and ease of assembly,it is widely used in industries such as electronics and electricalappliances.During use,different thicknesses of thermal silicone sheets are selected and cut according to the size and gap height of theheat-generating interface,and installed in the gap between the heat source and its heat dissipation component to provide thermal conductivity andinsulation.

Learn More

THERMAL CONDUCTIVE SILICONE CAP

LCV100U series thermal conductive silicone cap sleeve is a sleeve product produced by special process with high polymer and ceramic thermal conductive powder. Because of its excellent heat conduction, insulation, shockproof and convenient assembly, it is widely used in heating transistors, diodes and triodes. When in use, it is directly installed on the heating pipe. LCU series thermal conductive silicone cap sleeve is recommended to be used at low stress.

Learn More

CERAMIC HEAT SINK

Ceramic heat sink is a green environmental protection material. It belongs to microporous structure, which can increase he porosity by 30% under he same unit area, greatly increasing he heat dissipation area in contact with air and enhancing its heat dissipation eﬀect. At the same time, its heat capacity is small, its own heat storage capacity is small, and its heat can be transmitted to the outsideworld morequickly.The maincharacteristicsofceramic heatsinkareenvironmental protection, insulation, high voltage resistance, eﬃcient heat dissipation, and avoiding EMI problems. It can eﬀectively solve the heat conduction and heat dissipation problems in the electronics and home appliance industries.Atthe sametime, it is especialy suitable for products with smal and medium wat power consumption and light, thin, short and small design space. It can provide technical support and application for the innovation and development of electronic products.

Learn More