HIGH THERMAL CONDUCTIVITY SILICONE PAD

High thermal conductivity silicon fil m is a thin thermal insulation material with excellent comprehensive performance, which is made of glass fiber as the base material, heat conduction powder and high polymer, and is synthesized by special process. This material has high thermal conductivity, high friction resistance, high tensile strength, smooth and highly adherent surface and other advantages, which enable it to significantly reduce the interface thermal resistance under low pressure. It is widely used in occasions where high thermal conductivity and high electrical insulation are required. It is mainly used between the heating semiconductor device and the heat dissipation substrate for heat conduction and insulation.

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Category:

Insulated and thermally conductive silicone products

Keyword： HIGH THERMAL CONDUCTIVITY SILICONE PAD

Product Introduction Data Download

Product features

High thermal conductivity, high voltage insulation
Smooth on both sides, no stickiness, convenient for repeated assembly, reduce loss
The performance of puncture resistance is outstanding in the installation and application of screw and clip
Designed for applications that focus on electrical insulation

Typical applications

Electronic control module of automobile
Power / motor control
Audio amplifier
High frequency communication equipment
Discrete devices / power semiconductors

Test Item	Unit	LCV-160S	LCV-200S	LCV-350	Testing Method
Color	-	Pink	Pink	White	Visual estimation
Thickness	mm	0.23 ± 0.03	0.25 ± 0.03	0.23 / 0.38 ± 0.03	ASTM D374/D374M
Hardness	Shore A	85 ± 5	80 ± 5	90 ± 5	ASTM D2240
Density	g/cm³	2.48 ± 0.1	2.9 ± 0.1	1.5 ± 0.1	ASTM D792
Breakdown voltage	KV	≥5.0	≥6.0	≥4.0	ASTM D149
Temperature resistance range	°C	-50 to 200	-50 to 200	-40 to 200	-
Fire resistance performance		V-0	V-0	V-0	UL94
Fracture strength	N/25mm	>200	>100		ASTM D5035
Volume Resistivity	Ω·cm	≥10¹⁴	≥10¹³	≥1.0¹¹	ASTM D257
Dielectric constant	@1MHz	3.6	6.0	-	ASTM D150
Thermal impedance (@40 psi)	°C·in²/W	0.420(0.23T)	0.254(0.25T)	0.107(0.23T) 0.178(0.38T)	ASTM D5470
Thermal impedance (@40 psi)	°C·cm²/W	2.711 (0.23T)	1.640(0.25T) -	0.690(0.23T) 1.148 (0.38T)	ASTM D5470
Thermal conductivity	W/m·K	1.6	2.0	3.5	ISO 22007-2
Thermal conductivity	W/m·K	1.6	2.0	3.5	ASTM D5470

Basic specification: 300mm × 50M / roll, in which lcv-350 is 305mm * 305mm sheet, which can be cut into specific dimensions according to the use specification.

Customize Ultra High Thermal Conductivity Pad with reliable heat transfer, flexible sizes, and OEM support.

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