Thermal PAD

LOW SPECIFIC GRAVITY LOW DIELECTRIC THERMAL PAD

LOW SPECIFIC GRAVITY LOW DIELECTRIC THERMAL PAD

Low specific gravity and low dielectric conductivity hot silicon film is a low density and high thermal conductivity interface material made of boron nitride thermal conductive powder. The weight is only half of that of traditional thermal conductive silica gel, which is suitable for lightweight applications. Low dielectric constant and dielectric loss can effectively reduce the delay time in signal transmission, so that the signal reception and transmission can be carried out more smoothly. It is widely used in network communication equipment. The natural micro viscosity and softness of the surface can completely fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the heat dissipation performance.

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HEAT CONDUCTION RADIO ABSORBING PAD

HEAT CONDUCTION RADIO ABSORBING PAD

Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.

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ULTRA HIGH THERMAL PAD

ULTRA HIGH THERMAL PAD

Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.

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HIGH THERMAL PAD

HIGH THERMAL PAD

High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.

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THERMAL PAD

THERMAL PAD

LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.

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