Provide Heat Conduction and Cooling Solutions
PRODUCT
Highly stable and reliable thermal interface material
Thermal PAD
Thermal conductive pad can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces...
Thermal conductive sealant
Thermal conductive gel pad is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible...
FEATURED PRODUCTS
Highly stable and reliable thermal interface material
HEAT CONDUCTION RADIO ABSORBING PAD
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.
Learn more
LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
Learn more
High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
Learn more
Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
Learn moreABOUT US
14 Years Of Focus On R & D And Production Of Thermal Interface Materials
Shenzhen Union Tenda Technology Co., Ltd was established in 2011, registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters. which is a professional high-tech enterprise engaged in R&D, production and sales of thermal interface materials.
Production Base
Technology accumulation
R&D and technology investment
CERTIFICATE
Since its establishment, the company has successively passed: ISO9001 quality management system certification,ISO14001 environmental management system certification, ISO45001 occupational health and safety management system certification and IATF16949 quality management system certification
WHY CHOOSE US
Manufacturing Capability
R&D Capability
Cooperation Experience
Provide thermal conductivity and heat dissipation products and solutions for numerous customers
BLOG
Jun 05,2026
Understanding Ceramic Substrates for Power Electronics: A Guide for Professionals
Ceramic substrates for power electronics are increasingly gaining attention due to their superior thermal management, electrical insulation, and mechanical stability. These substrates play a critical role in enhancing the performance of power electronic devices, which are essential in various applications from renewable energy systems to electric vehicles. One of the primary advantages of ceramic
Jun 04,2026
Why Thermal Materials Matter for Energy-Efficient Smart Devices
Why Thermal Materials Matter for Energy-Efficient Smart Devices Table of Contents 1. Introduction to Thermal Materials and Their Importance 2. Understanding Thermal Management in Smart Devices 3. Types of Thermal Materials Used in Smart Devices 3.1. Thermal Conductors 3.2. Thermal Insulators 3.3. Phase Change Materials (PCMs) 4. The Role of
Jun 03,2026
The Benefits and Applications of Ceramic Heat Sink Substrates in Construction
Ceramic heat sink substrates are increasingly recognized for their ability to effectively dissipate heat, making them essential in a range of applications, especially where electronic components are involved. These substrates are typically made from ceramics like alumina or silicon nitride, which possess excellent thermal conductivity and mechanical strength. Their unique composition allows for ef
Jun 02,2026
Understanding Thermal Conductivity in Silicone Thermal Interface Materials: A Comprehensive Guide
Understanding Thermal Conductivity in Silicone Thermal Interface Materials In the rapidly advancing world of electronics, effective thermal management has become a critical component of device performance and reliability. Silicone thermal interface materials (TIMs) play a pivotal role in this arena. This article delves deep into the intricacies of thermal conductivity in silicone TIMs, providing y
Jun 01,2026
Understanding Thermal Conductive Silicone Caps: Essential Insights for Building Materials
--- Thermal conductive silicone caps are increasingly gaining attention in the construction and decorative materials sector due to their unique properties and versatile applications. These caps are designed to manage heat transfer effectively, making them an essential component in various building materials and applications. One of the primary attributes of thermal conductive silicone caps is thei
May 31,2026
Ceramic Substrates: A Game Changer for Power Electronics Technologies
Ceramic Substrates: A Game Changer for Power Electronics Technologies Table of Contents 1. Introduction to Ceramic Substrates 2. Understanding Ceramic Substrates in Power Electronics 3. Advantages of Ceramic Substrates Over Traditional Materials 4. Manufacturing Process of Ceramic Substrates 5. Key Applications of Ceramic Substrates in Power Electronics 6. Future Trends in Ceramic
Contact
Phone
Email:
Share to
Copyright © 2025 Shenzhen Union Tenda Technology Co.,Ltd All Rights reserved.
