Factors affecting the thermal conductivity of thermal silica gel pads
The main substrate of the thermal conductive silica gel sheet is silica gel. A thermal conductive medium material synthesized by adding special materials such as metal oxides through special processes. The following is a specific introduction to the factors affecting the thermal conductivity of the thermal conductive silica gel sheet.
1. Types and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the basic dispersibility of the filler, and the better the degree of bonding between them. Therefore, the thermal conductivity of the thermal conductive silicone sheet will be more it is good
2. Type of filler: The higher the thermal conductivity of the filler will directly affect the thermal conductivity of the silica gel sheet.
3. Filler content: The distribution of filler polymer determines the thermal conductivity of the thermal conductive silica gel. When the filler content is small, the thermal conductivity is not obvious; when the direction of the thermal conductive mesh is consistent with the direction of heat flow, the thermal conductivity the best. Therefore, there is a certain critical value for the amount of thermally conductive filler.
4. Shape of the filler: The passage which is easy to form a heat conduction order is whisker-fibrous-sheet-granular, and the more easily the filler forms a heat conduction path, the better the thermal conductivity.
5. Bonding characteristics of the interface between the filler and the substrate: The higher the degree of bonding between the filler and the substrate, the better the thermal conductivity. The surface of the filler is treated with a suitable coupling agent, and the thermal conductivity can be increased by 10% to 20%.
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